A study on the effect of bonding time on the properties of Al7075 to Ti–6Al–4V diffusion bonded joint
作者： M.S. Kenevisi , S.M. Mousavi Khoie
DOI: 10.1016/J.MATLET.2012.02.104
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摘要: Abstract Joining of two dissimilar aerospace alloys Al7075 and Ti–6Al–4V was carried out using transient liquid phase bonding 50 μm thick Sn–10Zn–3.5Bi film as interlayer. Cu coating electrodeposited onto the joining surfaces bonds were made at 500 °C for various times. At low times, eutectic phases between Al formed inside interlayer along grain boundaries. Also, intermetallics such TiAl Ti 3 time 60 min. The results showed that increases up to 60 min, hardness joint interface which can be attributed intermetallic compounds formation. Moreover, width region decreases increases. strength with increasing reaches 30 MPa
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sci-hub.se 参考文章(17)
M.S. Kenevisi, S.M. Mousavi Khoie, An investigation on microstructure and mechanical properties of Al7075 to Ti–6Al–4V Transient Liquid Phase (TLP) bonded joint Materials & Design. ,vol. 38, pp. 19- 25 ,(2012) , 10.1016/J.MATDES.2012.01.046
A.N. Alhazaa, T.I. Khan, Diffusion bonding of Al7075 to Ti–6Al–4V using Cu coatings and Sn–3.6Ag–1Cu interlayers Journal of Alloys and Compounds. ,vol. 494, pp. 351- 358 ,(2010) , 10.1016/J.JALLCOM.2010.01.037
John Askill, Tracer Diffusion Data for Metals, Alloys, and Simple Oxides ,(1970)
MK Lee, JG Lee, YH Choi, DW Kim, CK Rhee, YB Lee, SJ Hong, None, Interlayer engineering for dissimilar bonding of titanium to stainless steel Materials Letters. ,vol. 64, pp. 1105- 1108 ,(2010) , 10.1016/J.MATLET.2010.02.024
X.-Y Yan, Y.A Chang, F.-Y Xie, S.-L Chen, F Zhang, S Daniel, Calculated phase diagrams of aluminum alloys from binary Al–Cu to multicomponent commercial alloys Journal of Alloys and Compounds. ,vol. 320, pp. 151- 160 ,(2001) , 10.1016/S0925-8388(00)01469-9
J Geng, P Oelhafen, None, Photoelectron spectroscopy study of Al–Cu interfaces Surface Science. ,vol. 452, pp. 161- 171 ,(2000) , 10.1016/S0039-6028(00)00312-5
Paul Vianco, Jerome Rejent, Richard Grant, Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys Materials Transactions. ,vol. 45, pp. 765- 775 ,(2004) , 10.2320/MATERTRANS.45.765
Yao Wei, Wu Aiping, Zou Guisheng, Ren Jialie, Formation process of the bonding joint in Ti/Al diffusion bonding Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 480, pp. 456- 463 ,(2008) , 10.1016/J.MSEA.2007.07.027
A. AlHazaa, T.I. Khan, I. Haq, Transient liquid phase (TLP) bonding of Al7075 to Ti-6Al-4V alloy Materials Characterization. ,vol. 61, pp. 312- 317 ,(2010) , 10.1016/J.MATCHAR.2009.12.014
P.Y. Lim, P.L. She, H.C. Shih, Microstructure effect on microtopography of chemically etched α + β Ti alloys Applied Surface Science. ,vol. 253, pp. 449- 458 ,(2006) , 10.1016/J.APSUSC.2005.12.107