An investigation on microstructure and mechanical properties of Al7075 to Ti–6Al–4V Transient Liquid Phase (TLP) bonded joint
作者： M.S. Kenevisi , S.M. Mousavi Khoie
DOI: 10.1016/J.MATDES.2012.01.046
关键词: Eutectic system 、 Intermetallic 、 Materials science 、 Optical microscope 、 Metallurgy 、 Composite material 、 Bond strength 、 Energy-dispersive X-ray spectroscopy 、 Indentation hardness 、 Grain boundary 、 Microstructure
摘要: Abstract Transient Liquid Phase (TLP) bonding of two dissimilar alloys Al7075 and Ti–6Al–4V has been done at 500 °C under 5 × 10−4 torr. Cu was electrodeposited on surfaces, 50 μm thick Sn–4Ag–3.5Bi film used as interlayer process carried out several times. The microstructure the diffusion bonded joints evaluated by Light Optical Microscopy (LOM), Scanning Electron (SEM) Energy Dispersive Spectroscopy (EDS). eutectic intermetallic compounds formation along grain boundaries Ti/Al interface such θ(Al2Cu), TiAl Ti3Al were responsible for joint aluminum titanium interfaces. Microhardness shear strength tests to investigate mechanical properties bonds. Hardness increased with increasing time which can be attributed intermetallics interface. study showed that highest bond 36 MPa obtained samples joined 60 min.
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