Thermal analysis of epoxy-based nanocomposites: Have solvent effects been overlooked?

作者: Geoff Rivers , Allan Rogalsky , Pearl Lee-Sullivan , Boxin Zhao

DOI: 10.1007/S10973-013-3613-2

关键词: EpoxyComposite materialSolventNanoparticleMaterials scienceSolvent effectsDifferential scanning calorimetryGlass transitionThermal analysisNanocompositeChemical engineering

摘要: Analysis of the available published data calls into question some reported effects silver, graphene, and boron nitride nanoparticles on cure behavior glass transition temperature (Tg) epoxy-based conductive nanocomposites. The usefulness most studies is limited, as final Tg value only for a single composition. More useful provide comparison across compositions and/or to neat matrix material. However, main focus nanoparticle effect, while presence residual solvent generally overlooked. Although are too sparse firm conclusions, reductions in seem correlate with known or mild degas conditions (low temperature, unagitated), increases more likely when no used after rigorous degassing. Using control groups differentiate from filler effects, we conducted our own differential scanning calorimetry experiments. It was found that silver microparticles have statistically significant effect Tg, but appeared content not accounted for. erroneous apparent very similar literature. If must be used, recommend quantified sample representative without nanoparticles. present literature also suggests (i) surface chemistry has (ii) poor dispersion/aggregation results reduction Tg.

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