作者: Andrew A Wereszczak , Daniel J Vuono , Hsin Wang , Mattison K Ferber , Zhenxian Liang
DOI: 10.2172/1041433
关键词: Thermal transfer 、 Microstructure 、 Electrical resistivity and conductivity 、 Porosity 、 Composite material 、 Elastic modulus 、 Thermal expansion 、 Sintering 、 Materials science 、 Thermal conductivity
摘要: This report summarizes a study where various properties of bulk-sintered silver were investigated over a range of porosity. This work was conducted within the National Transportation Research Center's Power Device Packaging project that is part of the DOE Vehicle Technologies Advanced Power Electronics and Electric Motors Program. Sintered silver, as an interconnect material in power electronics, inherently has porosity in its produced structure because of the way it is made. Therefore, interest existed in this study to …