作者: Edward J. Furtek
DOI:
关键词: Infrared 、 Process (computing) 、 Electrical conductor 、 Convection 、 Thermal 、 Materials science 、 Optoelectronics 、 Optics 、 Wavelength 、 Reflow soldering 、 Substrate (electronics)
摘要: In conventional reflow soldering methods, such as the conductive, convective, and vapor phase damage to temperature-sensitive elements often occurs. infrared systems using focused emitters, large temperature differences between components substrate may also cause damage. These problems be overcome by a multi-zone thermal process system utilizing nonfocused panel emitters. An insulating housing has plurality of zones (1, 3, 4, 5) each having separate emitters (12, 14, 16, 18, 15, 17, 19) which heat product load traveling through zone in close proximity said panel(s) at different peak wavelengths 5). The emit middle far regions. across are held minimum.