Nanobonding: A key technology for emerging applications in health and environmental sciences
作者： Matiar M. R. Howlader , M. Jamal Deen , Tadatomo Suga
关键词: Silicon 、 Mechanical components 、 External pressure 、 Gallium arsenide 、 Fluidics 、 Nanometre 、 Photonics 、 Nanotechnology 、 Biosensor
摘要: In this paper, surface-activation-based nanobonding technology and its applications are described. This bonding allows for the integration of electronic, photonic, fluidic mechanical components into small form-factor systems emerging sensing imaging in health environmental sciences. Here, we describe four different techniques that have been used various substrates ? silicon, gallium arsenide, glass, gold. We use these to create electronic (silicon), photonic (silicon arsenide), microelectromechanical (glass silicon), glass) biosensing bioimaging being developed. Our technologies provide void-free, strong, nanometer scale at room temperature or low temperatures (<200 ?C), do not require chemicals, adhesives, high external pressure. The interfaces nanobonded materials ultra-high vacuum air correspond covalent bonds, hydrogen hydroxyl respectively.
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sci-hub.se 参考文章(88)
M Jamal Deen, Tor A Fjeldly, None, CMOS RF modeling, characterization and applications World Scientific. ,(2002) , 10.1142/4921
Plamen V . Kolev, M. Jamal Deen, Development and Applications of a New Deep Level Transient Spectroscopy Method and New Averaging Techniques Advances in Imaging and Electron Physics. ,vol. 109, pp. 1- 161 ,(1999) , 10.1016/S1076-5670(08)70196-4
Roy Chih Chung Wang, M. Jamal Deen, David Armstrong, Qiyin Fang, Development of a catadioptric endoscope objective with forward and side views Journal of Biomedical Optics. ,vol. 16, pp. 066015- ,(2011) , 10.1117/1.3593148
Thomas D. Wang, Jacques Van Dam, Optical Biopsy: A New Frontier in Endoscopic Detection and Diagnosis Clinical Gastroenterology and Hepatology. ,vol. 2, pp. 744- 753 ,(2004) , 10.1016/S1542-3565(04)00345-3
M. M. R. Howlader, F. Zhang, M. J. Deen, T. Suga, A. Yamauchi, Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature Journal of Vacuum Science and Technology. ,vol. 29, pp. 021007- ,(2011) , 10.1116/1.3549114
A. T. J. van Helvoort, K. M. Knowles, J. A. Fernie, Characterization of Cation Depletion in Pyrex during Electrostatic Bonding Journal of The Electrochemical Society. ,vol. 150, pp. G624- ,(2003) , 10.1149/1.1604116
A U Alam, M M R Howlader, M J Deen, The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass Journal of Micromechanics and Microengineering. ,vol. 24, pp. 035010- ,(2014) , 10.1088/0960-1317/24/3/035010
Isabelle Ferain, Pete Fleming, Michael Morris, Mark Goorsky, Cindy Colinge, Ki Yeol Byun, Low temperature germanium to silicon direct wafer bonding using free radical exposure Applied Physics Letters. ,vol. 96, pp. 102110- ,(2010) , 10.1063/1.3360201
P. V. Kolev, M. J. Deen, N. Alberding, Averaging and recording of digital deep-level transient spectroscopy transient signals Review of Scientific Instruments. ,vol. 69, pp. 2464- 2474 ,(1998) , 10.1063/1.1148975
Sung-Hoon Choa, Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems. ,vol. 15, pp. 677- 686 ,(2009) , 10.1007/S00542-009-0788-3