Method for quantifying the manufacturing complexity of electrical designs
作者： Richard P. Surprenant , Michael S. Cranmer
DOI:
关键词: Engineering 、 Electronic engineering 、 Value (computer science) 、 Image (mathematics) 、 Electrical wiring
摘要: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing wiring design. The number distinct features in the without with are determined differences between two obtained. difference is used as an indication shorting potential or probability that shorts may occur simulating be repeated value from each simulation run to obtain a statistical average representative
lens.org 参考文章(37)
Masahiro Takeda, Kazuhiro Hotta, Semiconductor failure analysis apparatus, failure analysis method, failure analysis program, and failure analysis system ,(2006)
Kaoru Sakai, Takafumi Okabe, Shunji Maeda, Inspection method and its apparatus, inspection system ,(2002)
Pieter J. Woltgens, Ulrich A. Finkler, Fook-Luen Heng, Gregory A. Northrop, Leon Stok, James A. Culp, Mark A. Lavin, John M. Cohn, Jin Fuw Lee, Nakgeuon Seong, Lars W. Liebmann, Rama N. Singh, Physical design system and method ,(2004)
Mauro V. Tegethoff, Method for manufacturing test simulation in electronic circuit design ,(1995)
Kwon Lim, Do-Young Kim, Methods, assemblies and systems for inspecting a photomask ,(2007)
Hiroshi Makihira, Satoru Fushimi, Yasuo Nakagawa, Takanori Ninomiya, Hitoshi Kubota, Shunji Maeda, Method of and apparatus for checking geometry of multi-layer patterns for ic structures ,(1985)
Gerard Lukpat, Alexander Miloslavsky, Fast lithography compliance check for place and route optimization ,(2010)
Yoshihiko Okamoto, Process for manufacturing semiconductor integrated circuit device, exposure method and mask for the process ,(1992)
Laertis Economikos, Richard P. Surprenant, Structure and a method for repairing electrical lines ,(1994)
Nicolas B. Cobb, Eugene Miloslavsky, Integrated opc verification tool ,(2008)