Integrated circuit package system for electromagnetic isolation
作者： Rui Huang , Heap Hoe Kuan , Byung Tai Do , Seng Guan Chow
DOI:
关键词: Lead (electronics) 、 Electrical engineering 、 Electronic engineering 、 Coating 、 Dual in-line package 、 Integrated circuit 、 Quad Flat No-leads package 、 Lead frame 、 Electromagnetic shielding 、 Engineering 、 Integrated circuit packaging
摘要: An integrated circuit package system comprising: providing a lead frame; forming an including the selectively exposed area on and coating conductive shielding layer for coupling area.
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