Semiconductor package with joint reliability, entangled wires including insulating material
作者： Hyun-Soo Chung , Jae-Shin Cho , Ki-Hyuk Kim , Jum-gon Kim , Seong-Deok Hwang
DOI:
关键词: Layer (electronics) 、 Semiconductor device 、 Line (electrical engineering) 、 Materials science 、 Optoelectronics 、 Electrical conductor 、 Semiconductor package 、 Wafer 、 Electrical engineering 、 Cable gland 、 Terminal (electronics)
摘要: A semiconductor package with improved joint reliability and a method of fabricating the are disclosed. conductive connector may be formed on surface wafer which devices arranged. first insulating layer including opening through portion connection pad is exposed wafer. rewiring line electrically connected to an layer. second terminal one or more entangled wires so as line.
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