Method of making an interposer sub-assembly in a printed wiring board
作者： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
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摘要: The details of a printed wiring board (PWB) sub-assembly and the method producing same are described. comprises circuit electrically joined through plurality connections to one or more area array devices, such as modules boards. can serve part an original assembly. function after market item that be readily substituted replacement for failed component wherein dimensional space between both devices must provide sufficient clearance surface mounted devices.
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