Coreless substrate package with symmetric external dielectric layers
作者： Pallavi Alur , Reynaldo Olmedo , Javier Soto Gonzalez , Sheng Li , Mihir Roy
DOI:
关键词: Electronic engineering 、 Photoresist 、 Dielectric 、 Substrate (printing) 、 Die (integrated circuit) 、 Materials science 、 Composite material 、 Layer (electronics)
摘要: A thin die Package Substrate is described that may be produced using existing chemistry. In one example, a package substrate built over support material. dry film photoresist layer formed the substrate. The material removed from and finished for use with package.
lens.org 参考文章(6)
Bernardo Gallegos, Gary Lee Engvall, Abram M. Castro, Electrical circuit and method of formation ,(2001)
Patrick W. Tandy, Apparatus and method for marking defective sections of laminate substrates ,(2002)
Debabrata Gupta, Saliya Witharana, Hamid Azimi, Method of forming copper layers ,(2005)
Koji Soejima, Masaya Kawano, Yoichiro Kurita, Semiconductor device including microstrip line and coplanar line ,(2007)
Tadanori Shimoto, Hideya Murai, Katsumi Kikuchi, Kazuhiro Baba, Hirokazu Honda, Keiichiro Kata, Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate ,(2003)
Tsutomu Imoto, Semiconductor Device and Manufacturing Method Thereof ,(2006)