Integrated circuit packaging system with coreless substrate and method of manufacture thereof
作者： YoungDal Roh , KyoungHee Park , JinHee Jung
DOI:
关键词: Substrate (printing) 、 Interconnection 、 Electronic engineering 、 Die (integrated circuit) 、 Integrated circuit 、 Composite material 、 Insulation layer 、 Materials science 、 Layer (electronics) 、 Integrated circuit packaging
摘要: A method of manufacture an integrated circuit packaging system includes: forming a first metal layer on carrier; insulation directly the layer; exposing portion for attaching to die interconnect connecting circuit; second opposite side exposed by removing and protective layer, external interconnect.
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