Semiconductor element-embedded wiring substrate

作者: Shintaro Yamamichi , Hideya Murai , Kentaro Mori , Katsumi Kikuchi , Yoshiki Nakashima

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摘要: A wiring substrate in which a semiconductor element is built includes element; peripheral insulating layer covering at least an outer circumferential side surface of this and upper surface-side line provided on the substrate. The internal terminal electrically connected to element. This first conductive part exposed out adhesion part; second layer. covers part, formed portion around extends edge so as surround part.

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