作者: Shintaro Yamamichi , Hideya Murai , Kentaro Mori , Katsumi Kikuchi , Yoshiki Nakashima
DOI:
关键词:
摘要: A wiring substrate in which a semiconductor element is built includes element; peripheral insulating layer covering at least an outer circumferential side surface of this and upper surface-side line provided on the substrate. The internal terminal electrically connected to element. This first conductive part exposed out adhesion part; second layer. covers part, formed portion around extends edge so as surround part.