Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

摘要: A semiconductor device has a substrate with plurality of conductive vias and layer formed over the substrate. die is mounted carrier. The to opposite An encapsulant deposited between carrier around die. TMVs through encapsulant. protrude from aid alignment interconnect structure. are electrically connected vias. removed an structure surface TMVs. devices can be stacked substrate, TMVs,