Wafer level semiconductor device connector
作者： Jocel P. Gomez
DOI:
关键词:
摘要: This document discusses, among other things, a semiconductor connector including conductive pad in recessed area on surface of dielectric, the dielectric material configured to be activated plating deposition using laser ablation.
lens.org 参考文章(18)
George W Schauer, Self-cleaning oven with temperature limiting protection system ,(1970)
Tzyy-Jang Tseng, Shu-Sheng Chiang, Solder pad structure for printed circuit boards and fabrication method thereof ,(2009)
Maria Clemens Y. Quinones, Maria Cristina B. Estacio, Flip clip attach and copper clip attach on MOSFET device ,(2005)
Erwin Victor Cruz, Maria Cristina B. Estacio, Pre-molded clip structure ,(2010)
Maria Clemens Y. Quinones, Maria Cristina B. Estacio, Semiconductor die package including low stress configuration ,(2008)
Frank Reil, Volker Pieper, Kai-Uwe Tonnes, Production of conductor tracks on plastics by means of laser energy ,(2001)
Nam P. Suh, Alonso R. Ramos, Elliot K. Chartash, Method for forming electrically conductive paths ,(1978)
Teck Kheng Lee, Method and apparatus for dielectric filling of flip chip on interposer assembly ,(2002)
Maria Clemens Y. Quinones, Ruben Madrid, Semiconductor die package including drain clip ,(2002)
Brian C. Auman, Harry Richard Zwicker, Carl B. Wang, Meredith L. Dunbar, Yueh-Ling Lee, Shane Fang, Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto ,(2005)