作者: Cheng-Tai Hsiao , Cheng-Yuan Tsai , Hsun-Chung Kuang , Sheng-Chau Chen
DOI:
关键词: Electrode 、 Tunnel magnetoresistance 、 Materials science 、 Magnetoresistive random-access memory 、 Connection (principal bundle) 、 Substrate (printing) 、 Magnetoresistance 、 Interconnection 、 Edge (geometry) 、 Optoelectronics
摘要: Some embodiments relate to a memory device. The device includes magnetoresistive random-access (MRAM) cell disposed on substrate, the MRAM comprises magnetic tunnel junction (MTJ) between lower electrode and an upper electrode. A sidewall spacer arranged along opposite sidewalls of cell. An interconnect wire directly contacting surface interface continuously extending from first outer edge second spacer.