Semiconductor device and the method for manufacturing the same
作者： Yoshikazu Takahashi , Takashi Ohsumi
DOI:
关键词: Semiconductor 、 Optoelectronics 、 Semiconductor chip 、 Layer (electronics) 、 Flip chip 、 Semiconductor device 、 Materials science 、 Electrical conductor
摘要: A semiconductor device includes a first chip having plurality of pads, second the being fixed over main surface chip, an insulating layer formed between and conductive posts electrically connected to pads on resin covering surfaces chips, partially posts.
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