Electroplating of conductive polymers for the metallization of insulators
作者： D.M. de Leeuw , P.A. Kraakman , P.F.G. Bongaerts , C.M.J. Mutsaers , D.B.M. Klaassen
DOI: 10.1016/0379-6779(94)90076-0
关键词: Sheet resistance 、 Electroplating 、 PEDOT:PSS 、 Materials science 、 Thin film 、 Copper 、 Polymer chemistry 、 Front velocity 、 Poly(3,4-ethylenedioxythiophene) 、 Composite material 、 Conductive polymer
摘要: … of bath on the uniformity of the final copper film, we also used commercial acid copper baths, which contain additives to improve throwing power and uniformity of the deposit. We used …
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