Wiring board and method for producing same
作者： Yoshihide Yamaguchi , Hiroyuki Tenmei , Mitsuko Itou , Yasunori Narizuka
DOI:
关键词: Layer (electronics) 、 Insulation layer 、 Composite material 、 Electrode 、 Soldering 、 Engineering drawing 、 Alloy 、 Materials science
摘要: The invention relates to a wiring board comprising having an electrode and being coated with insulation layer hole for exposing the electrode; Cr or Ti layer, which is connected closely contacts of Cu layer; protective film covers provided another soldering; solder outer connection mounted in both holes brought diffuse into produce alloy, reach thereby connecting layer.
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