Semiconductor device and manufacturing method of the same
作者： Takai Nobuyuki , Tsukada Yuji , Suzuki Takuya
DOI:
关键词: A titanium 、 Optoelectronics 、 Semiconductor 、 Etching 、 Passivation 、 Wafer dicing 、 Semiconductor device 、 Layer (electronics) 、 Aluminium 、 Materials science
摘要: The invention provides a semiconductor device with bonding pad made of wiring layer including aluminum and its manufacturing method that enhance the yield device. includes removing portion an antireflection (e.g. titanium alloy) formed on uppermost second aluminum) substrate by etching, forming passivation covering where is not having opening exposing other layer, dividing into plurality dice dicing. These processes can prevent from being exposed in opening, this component eluted due to cell reaction between as has been seen conventional art.
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