Method for forming chip package
作者： Chien-Hui Chen , Tsang-Yu Liu , Ming-Kun Yang , Yen-Shih Ho
DOI:
关键词:
摘要: An embodiment of the invention provides a method for forming chip package which includes: providing substrate having first surface and second surface, wherein at least two conducting pads are disposed on substrate; partially removing from to form holes extending towards correspondingly respectively align with one pads; after formed, recess overlaps holes; an insulating layer sidewall bottom trench sidewalls layer, electrically contacts pads.
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