Electrical connection device for high density contacts
作者： Jean Bonnefoy
DOI:
关键词: Electrical conductor 、 Substrate (printing) 、 Integrated circuit 、 Optoelectronics 、 Conductor 、 Engineering 、 Printed circuit board 、 Electrical connection 、 Electrical engineering 、 Connection (principal bundle) 、 Plane (geometry)
摘要: The invention provides an electrical connection device for connecting high density contacts of large scale integrated circuits (LSI) and serves to establish between the contact areas (15) circuit network (14) on a substrate (11) supporting devices (12) pads (18) conductor (17) printed card (13). electric comprises plurality conductive elements disposed within housing (26) extending in given direction. are electrically insulated one from other have which exposed through slots connect (18). (29) stacked direction formed each with sheet (30) provided two surfaces (31a, 32a) elastically movable plane normal independently neighboring sheets. supported deformable rolls length support means enable be displaced compensate deformities manufacturing tolerances.
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