作者: Eric V. Kline
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摘要: A high performance electromechanical device which improves electrical continuity between a under test (DUT) and socket (or contactor), ideally suited for, but not limited to, automated semiconductor test. An ultrasonic transducer is incorporated into the set-up such that its energy coupled either DUT thereby contacts of or leads equivalent I/O) DUT. This generates frequency mechanical wipe action microscopic amplitude contacting surfaces, displacing oxides other debris from contact site. enhances by reducing apparent resistance force rate. frequency/low can be varied controlled to yield an effective 10 times 100,000 greater than current state art.