Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

摘要: Curing kinetics of diglycidyl ether bisphenol-A (DGEBA) in the presence novel silicon containing amide-amines were investigated by dynamic differential scanning calorimetry. Silicon prepared reacting 2.5 moles 4,4'-diaminodiphenyl (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min-1) was used to study curing epoxy resins stoichiometric amounts having molecular masses range 660 760 g mol-1. peak exotherm temperature depends on as well structure amide-amines. Activation energy reaction determined accordance Ozawa's found be dependent amine. thermal stability isothermally cured also evaluated using thermogravimetry a nitrogen atmosphere. char yield highest case both phosphorus atoms.