The Effects of Bath Composition on the Morphologies of Electroless Nickel Under-Bump Metallurgy on Al Input/ Output Pad
作者： J. H. Lee , I. G. Lee , T. Kang , N. S. Kim , S. Y. Oh
DOI: 10.1007/S11664-005-0173-7
关键词: Chemistry 、 Nickel 、 Electrode potential 、 Transition metal 、 Zincate 、 Zinc 、 Metallurgy 、 Electroless nickel plating 、 Nucleation 、 Electroless nickel
摘要: The electroless nickel plating on an aluminum input/output (I/O) pad was investigated. pretreated in a zincate solution prior to plating. Zinc particles the gave good adherent layer. adhesion and uniformity of zinc is key factor under-bump metallurgy (UBM). electrode potential changes with without ions bath were measured analyze sequence two competing reactions: deposit hydrogen evolution. relationship between dissolution ratio NaOH deposition rate dependent composition. effects complexing ligand additive analyzed. Electrode time confirm nucleation grain growth. Adhesion UBM related zinc-particle nucleation. uniform fabricated real Al I/O pad.
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