The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips

作者: Kwang-Lung Lin , Shiuh-Yuan Chang

DOI: 10.1016/S0040-6090(96)08790-1

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摘要: … The zineating was conducted on the AI pads ( 100 × 100 × 1.5 l.tm 3) of silicon chips. Each chip consists of 400 AI pads. The zincating deposition conducted on the AI pads was a three-…

参考文章(9)
Juan B. Hajdu, Glenn O. Mallory, Electroless plating : fundamentals and applications The Society. ,(1990)
Paul D. Franzon, Daryl Ann Doane, Multichip Module Technologies and Alternatives: The Basics ,(1992)
F. J. Monteiro, M. A. Barbosa, D. H. Ross, D. R. Gabe, Pretreatments of improve the adhesion of electrodeposits on aluminium Surface and Interface Analysis. ,vol. 17, pp. 519- 528 ,(1991) , 10.1002/SIA.740170720
B. R. Strohmeier, W. T. Evans, D. M. Schrall, Preparation and surface characterization of zincated aluminium memory-disc substrates Journal of Materials Science. ,vol. 28, pp. 1563- 1572 ,(1993) , 10.1007/BF00363350
M P Seah, D Briggs, Practical Surface Analysis ,(1992)
P. G Sheasby, R Pinner, S Wernick, The surface treatment and finishing of aluminium and its alloys Published in <b>1987</b> in Metals Park (Ohio) by ASM international. ,(1987)
Wolfgang Riedel, Electroless Nickel Plating ,(1991)
John F Moulder, William F Stickle, Peter E Sobol, Kenneth D Bomben, Handbook of X-Ray Photoelectron Spectroscopy Physical Electronics. pp. 230- 232 ,(1995)