作者: Kwang-Lung Lin , Shiuh-Yuan Chang
DOI: 10.1016/S0040-6090(96)08790-1
关键词:
摘要: … The zineating was conducted on the AI pads ( 100 × 100 × 1.5 l.tm 3) of silicon chips. Each chip consists of 400 AI pads. The zincating deposition conducted on the AI pads was a three-…