作者: A. Callegari , E. Cartier , M. Gribelyuk , H. F. Okorn-Schmidt , T. Zabel
DOI: 10.1063/1.1417991
关键词: Hafnium 、 Analytical chemistry 、 Sputtering 、 Annealing (metallurgy) 、 Oxide 、 Passivation 、 Gate dielectric 、 Materials science 、 Silane 、 Sputter deposition
摘要: Hafnium oxides and hafnium silicate films were investigated as a possible replacement for the SiO2 gate dielectric. oxide formed by reactive sputtering from single Hf target in predominantly Ar atmosphere containing small additions of oxygen. silicates made adding He-diluted silane gas Si incorporation. By changing flow, different atomic concentrations incorporated into films. Depositions performed with substrate held at temperatures 22 °C 500 °C. The chemical composition was determined nuclear techniques. Optical reflectivity used to measure optical band gap. film morphology transmission electron microscopy (TEM) electrical properties measured capacitance–voltage current–voltage measurements using aluminum capacitors. TEM measurement showed that interfacial layer about 3 nm interface du...