Dual gauge leadframe
作者： Zhi-Gang Bai , Wai Wong Chow , Clem H. Brown
DOI:
关键词: Die (integrated circuit) 、 Gauge (instrument) 、 Heat sink 、 Computer hardware 、 Materials science 、 Composite material 、 Paddle
摘要: A leadframe (20) for a semiconductor device includes first portion (12) having perimeter that defines cavity (16) and plurality of leads (14) extending inwardly from the thickness. second (18) is attached to (16). The has die paddle received within (12). thickness greater than Such dual gauge suitable especially high power devices in which acts as heat sink.
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