Method and apparatus for multi-chip structure semiconductor package
作者： Lakshminarayan Viswanathan , Audel A. Sanchez , Fernando A. Santos
DOI:
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摘要: A packaged semiconductor device may include a leadframe and die carrier mounted to the leadframe. The is formed from an electrically thermally conductive material. surface of with attach material having melting point in excess 240° C. first electrical interconnect couples housing covers portions leadframe, carrier, interconnect.
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