High power shunt switch with high isolation and ease of assembly

摘要: A high power shunt switch comprises a leadframe including paddle for supporting element, and plurality of bond pads located around periphery the paddle, wherein at least first subset are aligned in substantially straight-line configuration. element is fixedly attached to wire bonded top surface one pads. An encapsulant disposed on pads, bond, thereby forming an encapsulated package structure. The structure positioned transmission line such that bottom surfaces each simultaneous contact with line. suitable substrate.