Integrated circuit with substantially perpendicular wire bonds
作者： Joseph Michael Freund , Donald Farrell , John M. Brennan
DOI:
关键词:
摘要: An integrated circuit comprises an package and a plurality of elements disposed within the package. A wire bonds provide connections for at least one elements. At bond in first subset second are substantially perpendicular to another crossing point plan view circuit.
lens.org 参考文章(14)
Lee R. Levine, William J. Holdgrafer, Douglas L. Gauntt, Method of making constant clearance flat link fine wire interconnections ,(1992)
Jr. Emil James Crescenzi, Packaged rf power transistor having rf bypassing/output matching network ,(2003)
Edward B. Stoneham, Clifford A. Mohwinkel, Coplanar oscillator circuit structures ,(1998)
John H. Titizian, Jeffrey A. Burger, Young Ii Kim, Radio frequency power device ,(2000)
Lee B. Max, Package for push-pull semiconductor devices ,(1977)
Prasanth Perugupalli, Nagaraj Vishwanath Dixit, Gordon C. Ma, Larry Leighton, RF power transistor with internal bias feed ,(2003)
Ted Johansson, Larry Leighton, Ivar Hamberg, Layout for radio frequency power transistors ,(1995)
Henrik Hoyer, Thomas Moller, Jeff Hume, Alignment pedestals in an LDMOS power package ,(2000)
Gideon van Zyl, Semiconductor package for multiple high power transistors ,(2002)
Larry Clifford Leighton, Ted Johansson, Method for manufacturing vertical bipolar transistor having a field shield between an interconnecting layer and the field oxide ,(1998)