Method of manufacturing a semiconductor device having an electrode exposed through a hole
作者： Kenji Komeda
DOI:
关键词: Substrate (printing) 、 Materials science 、 Isotropic etching 、 Electrode 、 Optoelectronics 、 Semiconductor device
摘要: A method of manufacturing a semiconductor device may include, but is not limited to the following processes. first insulating film formed over substrate. second on film. An electrode penetrating and films formed. part are removed so that hole in portion exposed through hole. by an isotropic etching.
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