Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
作者： Paul H. Wermer , Debabrata Gupta , Kishore K. Chakravorty , David G. Figueroa
DOI:
关键词: Signal 、 Optoelectronics 、 Ceramic 、 Die (integrated circuit) 、 Electronic engineering 、 Layer (electronics) 、 Integrated circuit 、 Materials science 、 Permittivity 、 Capacitor 、 Substrate (printing)
摘要: To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to respective at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In embodiment, ceramic portion substrate includes formed high permittivity layer sandwiched between conductive planes. An organic suitable routing and fan-out signal conductors. The build-up multiple layers material overlying portion. Also described electronic system, data processing various methods manufacture.
lens.org 参考文章(68)
Mukta S. Farooq, Herbert I. Stoller, Harvey C. Hamel, Robert A. Rita, High k dielectric capacitor with low k sheathed signal vias ,(1998)
Shinji Baba, Semiconductor device with stacked vias ,(2000)
Gregory L. Lucas, Capacitive PCB with internal capacitive laminate ,(1997)
Yoshitaka Fukuoka, Multi-chip module and production method thereof ,(1996)
Kenji Ito, MCM manufactured by using thin film multilevel interconnection technique ,(1994)
Leo M. Higgins, Shielded electronic component assembly and method for making the same ,(1994)
Herbert I. Stoller, Leon L. Wu, Charles J. +Di Kraus, Warren D. Grobman, Electronics system with direct write engineering change capability ,(1990)
Ameet Bhansali, Qing Zhu, Multi-layer C4 flip-chip substrate ,(1996)
Masayoshi Yagyu, Mitsuo Usami, Hiroyuki Itoh, Masahide Tokuda, Yuuji Fujita, Takeshi Kato, Chip connection structure having diret through-hole connections through adhesive film and wiring substrate ,(1995)
J. D. Baniecki, R. B. Laibowitz, T. M. Shaw, P. R. Duncombe, D. A. Neumayer, D. E. Kotecki, H. Shen, Q. Y. Ma, Dielectric relaxation of Ba0.7Sr0.3TiO3 thin films from 1 mHz to 20 GHz Applied Physics Letters. ,vol. 72, pp. 498- 500 ,(1998) , 10.1063/1.120796