Development of a Process Data-based Strategy for Conditioning Position-controlled ID Cut-off Grinding Wheels in Silicon Wafer Manufacturing
作者： Uwe Teicher , Wolfgang Dietz , Andreas Nestler , Alexander Brosius
DOI: 10.1016/J.PROMFG.2017.07.349
关键词: Wafer 、 Position (vector) 、 Process (computing) 、 Automotive engineering 、 Wafering 、 Grinding wheel 、 Manufacturing engineering 、 Grinding 、 Process automation system 、 Quality (business) 、 Engineering
摘要: Abstract Manufacturing technologies in the semiconductor industry put high demands on accuracy, especially for initial steps of wafering. ID grinding has established itself as a cost-effective manufacturing method production wafers with diameter up to 150 mm. Methods improving quality parameters wafer, resulted integration magnetic position control wheel its axial position. For this, new conditioning strategy had be developed consideration tool life wheel, process automation and wafer quality.
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