作者: Jun Yamamuro , Kenji Fujii , Keiji Matsumoto , Shuji Koyama , Sakai Yokoyama
DOI:
关键词: Substrate (printing) 、 Composite material 、 Head (vessel) 、 Layer (electronics) 、 Materials science
摘要: Disclosed is a method of including the steps preparing substrate having flow-path-wall member; bonding member to resin layer that composed photo-curing and serves as ejection port such spaces serving flow paths are provided between resin; providing through-holes in communicate with outside air; exposing part light form an exposed portion unexposed portion; heating layer; removing from heated ports, thereby forming member.