Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
作者： Katsutoshi Mine , Kazumi Nakayoshi , Akihiko Kobayashi , Ryoto Shima , Yoshito Ushio
DOI:
关键词: Semiconductor device 、 Electrical connection 、 Elastomer 、 Young's modulus 、 Curing (chemistry) 、 Semiconductor chip 、 Adhesive 、 Composite material 、 Materials science
摘要: An anisotropically electroconductive adhesive film is characterized by containing an elastomer that traverses the thickness of and insulated in plane comprising electrically insulating elastomer, both have a modulus elasticity at 150° C. no greater than 100 MPa. A method for producing forming through holes across thereafter filling with composition, curing composition to form after holes. semiconductor device electrical connection terminals chip interconnect pads substrate aforementioned film.
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