Process For Flip-Chip Connection of an Electronic Component
作者： Fabrice Soufflet , Olivier Limousin
DOI:
关键词: Interconnection 、 Connection (principal bundle) 、 Substrate (printing) 、 Adhesive 、 Electronic component 、 Optoelectronics 、 Etching (microfabrication) 、 Materials science 、 Flip chip 、 Electronic engineering 、 Electrical conductor
摘要: The invention relates to a process for flip-chip connection of an electronic component (D) substrate (B), characterized in that it comprises producing at least one interconnect pad (PC) by etching thick conductive film and bonding it, means adhesive, between receiving or area said (PAS) substrate.
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