Electronic devices employing adhesive interconnections including plated particles

摘要: Electronic devices formed by bonding and interconnecting one or more electronic components to an circuit substrate employ specialized adhesives comprising gold-plated, platinum-plated and/or palladium-plated particles in a polymeric adhesive system which may include thermoplastic thermosetting resins. These plated beneficially provide electrical conductivity through the for electrically contact pads on with resistance migration of metal, thereby enabling interconnection at very fine pitch spacing. Polymers substantial flexibility low glass transition temperature are preferred over rigid Particles having morphology shapes that higher aspect ratios because lesser volume fraction loading is needed establish good adhesive. A combination high ratio spherical be employed enhance thermal without substantially increasing overall cost conductive polymer system. employing invention such applications as semiconductor die attachment, flip-chip device interconnection, component attachment printed wiring boards, jumper like.