Flip chip technology using electrically conductive polymers and dielectrics
作者： Richard H. Estes , Frank W. Kulesza
DOI:
关键词: Materials science 、 Polymer 、 Composite material 、 Flip chip 、 Substrate (printing) 、 Layer (electronics) 、 Dielectric 、 Electrically conductive
摘要: A method is presented for interconnecting bond pads of a flip chip with substrate by an electrically conductive polymer. An organic protective layer selectively formed over surface to thereby leave exposed on the chip. polymerizable precursor disposed extending level beyond form bumps. The bumps are aligned and then contacted those pads. can be polymerized either before or after contacting interconnections between substrate.
google.com.jm 参考文章(18)
Chris A. Dalamangas, Joseph P. Kosiarski, Leonard S. Buchoff, Conductive elastomeric contacts and connectors ,(1974)
Erick G. Walton, Joseph G. Schaefer, David A. Gardner, James G. Ryan, Chromium-titanium alloy ,(1988)
R. P. Mandal, Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits Final Report Applied Technology. ,(1976)
Akiteru Rai, Keiji Yamamura, Takashi Nukii, Method of making a hybrid semiconductor device ,(1987)
Akio Nakamura, Naoki Kodama, Osami Hayashi, Hirofumi Saita, A method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby Microelectronics Reliability. ,vol. 31, ,(1988) , 10.1016/0026-2714(91)90250-B
Isao Furuta, Yoshihiro Hirata, Junichi Arima, Hidefumi Kuroki, Shigeru Harada, Hajime Arai, Semiconductor device and a method of producing same ,(1987)
Richard Scheuenpflug, Method and apparatus to bond a semiconductor chip to a carrier ,(1991)
Lothar Gademann, Peter Flohrs, Juergen Hartmann, Process for producing a hybrid semiconductor structure and semiconductor structure thus produced ,(1991)
Jean-Pierre Gloton, Process for making a connection to an integrated circuit contact stud, and contact structure ,(1988)