Flip chip silicone pressure sensitive conductive adhesive
作者： Clayton R. Bearinger , Loren Andrew Haluska , Jack St. Clair Kilby , Keith Winton Michael , Robert Charles Camilletti
DOI:
关键词: Copper 、 Siloxane 、 Silicone resin 、 Glass microsphere 、 Adhesive 、 Silicone 、 Glass fiber 、 Flip chip 、 Composite material 、 Materials science
摘要: A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of chip substrate. The is a conductive silicone pressure sensitive containing (i) resin, (ii) siloxane gum, (iii) particulate material, optionally, (iv) peroxide catalyst. Suitable materials are silver-clad glass fibers; spherical gold particles; hollow microspheres coated silver, gold, nickel, or copper; particles metal alloys Sn/Cu, Pb/Sn, Au/Sn. can be applied as ball bump itself, in conjunction solder bump, form tape sandwiched
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