Process for making a connection to an integrated circuit contact stud, and contact structure

作者： Jean-Pierre Gloton

DOI:

关键词: Polycrystalline silicon 、 Materials science 、 Adhesive 、 Integrated circuit 、 Composite material 、 Aluminium 、 Process (computing) 、 Engineering drawing 、 Electrical conductor 、 Connection (principal bundle) 、 Layer (electronics)

摘要: Process for forming a contact in relief on an aluminium pin of integrated circuit, comprising the following steps: providing conductive polycrystalline silicon layer (23) beneath (21); locally removing so as to reveal part surface layer; establishing connection with by means drop adhesive (30). …