Flip-chip semiconductor device
作者： Kazumi Nakayoshi , Katsutoshi Mine
DOI:
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摘要: The present invention provides flip-chip type semiconductor devices wherein the electrical terminals (4) on element (1) are bonded to corresponding (5) base plate (3) or other substrate using an electrically conductive silicone elastomer (6) exhibiting a specified range of Young's modulus values and space between passivated active surface is filled with insulating elastomeric sealant (7). use prolongs useful life device.
lens.org 参考文章(4)
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