SEALING METHOD FOR SEMICONDUCTOR DEVICE

摘要: PURPOSE:To make a semiconductor device have high performance by forming through hole in which the inner surface is metallized substrate or slid, mounting lid, then feeding gas via into and sealing soldering unit. CONSTITUTION:A 12 formed an Al2O3 lid 11, aluminum layer accumulated, IC ship 14 them mounted on package body 40, metal rod 20 secured to 11 bonding with epoxy resin body. The lead pin 42 of PIN-PD 41 hermetically attached side 40 are connected soldering, cover 43 mounted. Thus, since it not necessarily exposed temperature for long time due sealing, there no face that chip damage, turn, soldered part can be used therein substrate.