Two step SMT method using masked cure

摘要: A method for temporarily attaching an electrical component to a pad, testing the component, removing and replacing if necessary, making final attachment of pad. The provides removal components, from pads located on substrate printed circuit board, wherein enables components be easily removed prior assembly without damaging board or mounted thereon. utilizes layer conductive, radiation-curable adhesive placed between component's lead Radiation is then directed through mask onto portion layer, which cures while leaving remaining area uncured. Because that receives radiation, consequently cured by only limited whole may pad applying small mechanical force. Following such removal, replacement thereof attached area. stage uncured exposing radiation.