Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
作者： Amy B. Ostrander , Raymond A. Jackson , Thomas E. Lombardi , John U. Knickerbocker
DOI:
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摘要: A structure and method for converting a standard ceramic carrier into temporary chip attach carrier, wherein the device comprises substrate, plurality of metal vias interspersed in layer further comprising cavity dam with holes filled conductive adhesive. The process forming applying secondary on adhesive holes, curing adhesive, placing containing C4 solder bumps onto layer, force chip, testing burning-in removing from separating then re-using layer.
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