Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
作者： David Jacob Perlman , John Edward Cronin , Claude Louis Bertin , James Marc Leas , Kenneth Edward Beilstein
DOI:
关键词:
摘要: A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to side surface. The includes providing an composed of stacked integrated circuit chips. is on temporary support which used attach the module. disclosed techniques may also be for attaching interposer, include active circuity, Specific details method, resulting multichip packages, various structures are set forth.
google.fr 参考文章(42)
William S. Phy, Lead format for tape automated bonding ,(1983)
David F. Capps, Integrated circuit bus structure ,(1992)
Rudolf Polster, Ernst Neuwirth, Sigurd Wilhelm, Norbert Bethke, Jorg Wagner, Henrik Brehler, Device for damping torsional vibrations in a drive train ,(1995)
Harvey G. Cragon, Charles L. Hutchins, Method of electrically connecting integrated circuits by edge-insertion in grooved support members ,(1990)
Kenzo Hatada, Stack type semiconductor package ,(1990)
John C. Carson, Ronald J. Indin, Stuart N. Shanken, Module comprising ic memory stack dedicated to and structurally combined with an ic microprocessor ,(1993)
Francis R. White, Paul A. Farrar, Willem B. van der Hoeven, Howard L. Kalter, Claude L. Bertin, Gordon A. Kelley, Three-dimensional multichip packages and methods of fabrication ,(1991)
Tiong C. Go, High-density electronic modules--process and product ,(1987)
Paul William Coteus, Mark B. Ritter, George Frederick Walker, Philip Murphy, Paul Andrew Moskowitz, Stepped electronic device package ,(1992)