Method for mounting electronic elements
作者： Yukio Yamada , Motohide Takeichi
DOI:
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摘要: A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between circuit board, situated on stage, and an element to be connected with wiring pattern then bonding board by application heat pressure from side. The is temporarily thermocompression-bonded such that reaction rate side lower than element. set finally in order bond board.
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