Smart card module for data storage used in payment purposes, has encapsulation covering chip contacting conductor structures on top surface of substrate
作者： Wolfgang Schindler , Frank Püschner , Bernhard Drummer
DOI:
关键词: Computer data storage 、 Electronic engineering 、 Chip 、 Smart card 、 Optoelectronics 、 Engineering 、 Conductor 、 Encapsulation (networking)
摘要: The module has contact arrays (4) arranged on a bottom surface (3) of substrate (1) where the dimensions conform to ISOstandard. Conductor structures (5) top (2) are connected arrays, which have through paths (6) in cutouts substrate. A chip (8) electrically conductively contacts conductor structures. An encapsulation (10) covers and portion
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