Chip card for integrated circuit mfr.

摘要: The chip card has a module (2) with structured metallising (20) forming the electrically conductive contact surfaces (20A), one or more coloured zones developed by chemical reaction between colouring solution at surface of and/or close to (20). can be Au, Pd, Ag, Ni, Sn etc. plastic substrate is PVC, polyethylene, an epoxy resin glass fibre reinforcement etc..