Chip card with insulating layer in recess in vicinity of contact area

摘要: The chip module (4) is enclosed in a cavity (3) plastic carrier (2) and includes an integrated circuit (5) with lead wires (6) to contact surface (7) divided into pads. Among the pads circular recess (8) formed be filled insulating layer (9) which extends edges (10) through centre (11). An intermediate supporting (12) optionally provided between layer, holes (13) for wires. produces no unwanted bridging vicinity of surface. if any, glass fibre reinforced strengthening card.